CONNECT WITH US

Micron announces mobile 3D NAND solutions for flagship smartphones

Jessie Shen, DIGITIMES, Taipei 0

Micron Technology has announced three new 64-layer, second-generation 3D NAND storage products, which support the high-speed Universal Flash Storage (UFS) 2.1 standard. Micron's new mobile 3D NAND products are available in 256GB, 128GB and 64GB capac...

The article requires paid subscription. Subscribe Now