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FCBGA substrate supply tight on packaging demand for pre-5G chips

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Wednesday 5 September 2018 0

Taiwan IC backend service firms have seen increasing flip-chip packaging orders from China chipmaker HiSilicon now actively carrying out volume production of pre-5G chip products, leading to tight supply of FCBGA (FC ball grid array) substrates, with...

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