HPE Intel Xeon-Gold 6230R (2.1GHz/26-core/150W) Processor Kit for ProLiant DL360 Gen10
- Brand: HPE
- Category:
- SKU: P24482-B21
- EAN: 0190017437576
HPE Intel Xeon-Gold 6230R (2.1GHz/26-core/150W) Processor Kit for ProLiant DL360 Gen10, Intel® Xeon® Gold, LGA 3647 (Socket P), 14 nm, Tray, Intel, 6230R
Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
|
HPE INTEL XEON-G 6230R KIT |
Z30569 | |||
|
LA DL360 GEN10 6230R KIT |
13596161 |
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Description
HPE Intel Xeon-Gold 6230R (2.1GHz/26-core/150W) Processor Kit for ProLiant DL360 Gen10. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Width: 3.5" (88.9 mm), Depth: 4.25" (108 mm), Height: 1" (25.4 mm)
Specifications
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.1 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 35.75 MB |
| Processor model | 6230R |
| Processor threads | 52 |
| System bus rate | 10.4 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 4 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 26 |
| Processor socket | LGA 3647 (Socket P) |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 1 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Technical details | |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 150 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| PCI Express slots version | 3.0 |
| Scalability | 2S |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Packaging data | |
| Package type | Tray |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Width | 3.5" (88.9 mm) |
| Weight | 19 oz (540 g) |
| Height | 1" (25.4 mm) |
| Depth | 4.25" (108 mm) |
