HPE Intel Xeon-Platinum 8380 2.3GHz 40-core 270W Processor for
- Brand: HPE
- Category:
- SKU: P36941-B21
- EAN: 0190017503004
HPE Intel Xeon-Platinum 8380 2.3GHz 40-core 270W Processor for, Intel® Xeon® Platinum, LGA 4189, 10 nm, Tray, Intel, 2.3 GHz
Offer details
Trade Prices
| Distributor | Product | SKU | Stock | Updated | Price |
|---|---|---|---|---|---|
|
Intel Xeon-Platinum 8380 (2.3GHz/40-core/270W) Processor |
51844 |
Description
HPE Intel Xeon-Platinum 8380 2.3GHz 40-core 270W Processor for. Processor family: Intel® Xeon® Platinum, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6.14 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Width: 15" (381 mm), Depth: 19.3" (489 mm), Height: 11.5" (292.1 mm)
Specifications
| Processor | |
|---|---|
| Processor generation | 3rd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.3 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Ice Lake |
| Thermal Design Power (TDP) | 270 W |
| Processor cache | 60 MB |
| Processor model | 8380 |
| Processor threads | 80 |
| System bus rate | 11.2 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.4 GHz |
| Processor lithography | 10 nm |
| Processor family | Intel® Xeon® Platinum |
| Processor cores | 40 |
| Processor socket | LGA 4189 |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 6.14 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 270 W |
| Technical details | |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Thermal Design Power (TDP) | 270 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 64 |
| Thermal Design Power (TDP) | 270 W |
| PCI Express slots version | 4.0 |
| Scalability | 2S |
| Market segment | Server |
| Packaging data | |
| Package type | Tray |
| Weight & dimensions | |
| Width | 15" (381 mm) |
| Weight | 24 oz (680 g) |
| Height | 11.5" (292.1 mm) |
| Depth | 19.3" (489 mm) |
