HPE Intel Xeon-Silver 4214R (2.4GHz/12-core/100W) Processor Kit for ProLiant DL360 Gen10

  • Brand: HPE
  • Category:
  • SKU: P15977-B21
  • EAN: 0190017362557 4549821285167
HPE Intel Xeon-Silver 4214R (2.4GHz/12-core/100W) Processor Kit for ProLiant DL360 Gen10, Intel Xeon Silver, LGA 3647 (Socket P), 14 nm, Tray, Intel, 4214R

Trade Prices

Distributor Product SKU Stock Updated Price
B2X Global

Intel Xeon-Silver 4214R (2.4GHz/12-core/100W)

44888 Register free see stock
Ingram Micro

HPE DL360 GEN10 4214R KIT

7HF695
TD Synnex

LA INTEL XEON-S 4214R KIT FOR DL360 G10

13604624

Description

HPE Intel Xeon-Silver 4214R (2.4GHz/12-core/100W) Processor Kit for ProLiant DL360 Gen10. Processor family: Intel Xeon Silver, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Scalability: 2S. Width: 3.5" (88.9 mm), Depth: 4.25" (108 mm), Height: 1" (25.4 mm)

Specifications

Processor
Processor generation2nd Generation Intel® Xeon® Scalable
Processor base frequency2.4 GHz
Processor manufacturerIntel
Cooler includedNo
Processor codenameCascade Lake
Thermal Design Power (TDP)100 W
Processor cache16.5 MB
Processor model4214R
Processor threads24
System bus rate9.6 GT/s
Processor operating modes64-bit
Processor boost frequency3.5 GHz
Component forServer/workstation
Processor lithography14 nm
Processor familyIntel Xeon Silver
Processor cores12
Processor socketLGA 3647 (Socket P)
Processor cache typeL3
Package typeTray
Memory
Maximum internal memory supported by processor1 TB
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor2400 MHz
Memory channelsHexa-channel
Graphics
Discrete graphics cardNo
On-board graphics card modelNot available
On-board graphics cardNo
Discrete graphics card modelNot available
Power
Thermal Design Power (TDP)100 W
Technical details
PCI Express slots version3.0
Scalability2S
Thermal Design Power (TDP)100 W
Market segmentServer
Processor cache typeL3
Features
Maximum number of PCI Express lanes48
Thermal Design Power (TDP)100 W
PCI Express slots version3.0
Scalability2S
Market segmentServer
Harmonized System (HS) code85423119
Packaging data
Package typeTray
Logistics data
Harmonized System (HS) code85423119
Weight & dimensions
Width3.5" (88.9 mm)
Weight19 oz (540 g)
Height1" (25.4 mm)
Depth4.25" (108 mm)