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Description
HPE 610860-B21. Processor family: Intel® Xeon® 5000 Sequence, Processor socket: Socket B (LGA 1366), Processor lithography: 32 nm. Memory channels: Triple-channel, Maximum internal memory supported by processor: 288 GB, Memory clock speeds supported by processor: 800,1066,1333 MHz. Market segment: Server. Weight: 3 lbs (1.36 kg). L1 cache: 0.384 MB
Specifications
Processor | |
---|---|
Processor base frequency | 2.66 GHz |
Memory bandwidth supported by processor (max) | 32 GB/s |
Thermal Design Power (TDP) | 95 W |
Processor cache | 12 MB |
Processor model | X5650 |
Processor threads | 12 |
System bus rate | 6.4 GT/s |
Processor operating modes | 64-bit |
L1 cache | 0.384 MB |
VID Voltage Range | 0.75 - 1.35 V |
Processor boost frequency | 3.06 GHz |
CPU multiplier (bus/core ratio) | 20 |
Component for | Server/workstation |
Processor lithography | 32 nm |
Processor family | Intel® Xeon® 5000 Sequence |
Processor front side bus | 1333 MHz |
Processor cores | 6 |
Processor socket | Socket B (LGA 1366) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 288 GB |
Memory clock speeds supported by processor | 800,1066,1333 MHz |
Memory bandwidth supported by processor (max) | 32 GB/s |
Memory channels | Triple-channel |
ECC | Yes |
Power | |
Thermal Design Power (TDP) | 95 W |
VID Voltage Range | 0.75 - 1.35 V |
Features | |
Thermal Design Power (TDP) | 95 W |
Market segment | Server |
Operational conditions | |
Maximum operating temperature | 81.3 °C |
Technical details | |
Thermal Design Power (TDP) | 95 W |
Market segment | Server |
Processor cache type | L3 |
Weight & dimensions | |
Weight | 3 lbs (1.36 kg) |
Other features | |
L1 cache | 0.384 MB |