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Description
HPE Intel Xeon E5-2667 2.90GHz. Processor family: Intel® Xeon® E5 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 32 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 750 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Scalability: S2S. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x
Specifications
Processor | |
---|---|
Processor base frequency | 2.9 GHz |
Memory bandwidth supported by processor (max) | 51.2 GB/s |
Thermal Design Power (TDP) | 130 W |
Processor cache | 15 MB |
Processor model | E5-2667 |
Processor threads | 12 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
VID Voltage Range | 0.60 - 1.35 V |
Processor boost frequency | 3.5 GHz |
Number of QPI links | 2 |
CPU multiplier (bus/core ratio) | 35 |
Bus type | QPI |
Component for | Server/workstation |
Processor lithography | 32 nm |
Processor family | Intel® Xeon® E5 Family |
Processor front side bus | 1600 MHz |
Processor cores | 6 |
Processor socket | LGA 2011 (Socket R) |
Processor cache type | L2 |
Memory | |
Maximum internal memory supported by processor | 750 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 800,1066,1333,1600 MHz |
Memory bandwidth supported by processor (max) | 51.2 GB/s |
Memory channels | Quad-channel |
ECC | Yes |
Graphics | |
On-board graphics card | No |
Power | |
Thermal Design Power (TDP) | 130 W |
VID Voltage Range | 0.60 - 1.35 V |
Technical details | |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | Yes |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel Flex Memory Access | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
PCI Express slots version | 3.0 |
Scalability | S2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Embedded options available | No |
CPU configuration (max) | 2 |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Thermal Design Power (TDP) | 130 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | L2 |
Features | |
Maximum number of PCI Express lanes | 40 |
Thermal Design Power (TDP) | 130 W |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Scalability | S2S |
Embedded options available | No |
CPU configuration (max) | 2 |
Market segment | Server |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel® Turbo Boost Technology | Yes |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel Flex Memory Access | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 85 °C |
Other features | |
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
CPU configuration (max) | 2 |